d2p Benefits
RF System Optimization
PakerVision's d2p technology provides important advancements and benefits in RF functionality. From unsurpassed improvements in transmit efficiency to full multi-mode operation, d2p technology allows for a new and impressive way of viewing the transmit sub-system in mobile communications.
Efficiency
Many RF power component touts efficiency improvements, particularly those that are targeted for end products that are battery operated. A critical attribute of the user experience for mobile devices is the longevity of the battery life. Since 3G handsets typically specify 2.5 - 3 hours of battery life and regularly (in actual use) achieve much less than that, the time has come to improve the efficiency of the mobile transmitter. The ParkerVision d2p system provides a considerable increase in power efficiency across the operating range of the transmit chain.
Cost / Size
d2p can handle any waveform with one implementation. Traditionally, system design had to account for various waveforms such as 3G WCDMA and 2G GSM/GPRS by having multiple, application-optimized transmit chains to handle these various waveforms. In contrast, d2p eliminates redundant transmit chains. This leads to smaller, less-complex RF sub-systems and long-lasting mobile platform architectures. Additionally, d2p also has the capability of replacing GaAs power stages with SiGe enabling even further levels of integration and reduced cost.
Multi-mode
d2p is the first practical RF transmit chain system capable of processing
all known waveforms for the commercial mobile handset market. This aids in
reducing the complexity of the mobile handset, equating to a reduction in
cost, size and time to market. This benefit also allows the designer to
develop a single reusable platform, reducing future development cycles.
Less Heat
d2p's unique topology coupled with its high efficiency enables designs that
generate less heat than competing solutions (this is particularly important
for small form factor handsets, mobile data cards, and highly integrated
cell phone architectures). Packaging and mechanical problems associated with
heat dissipation are greatly diminished.
